Micro Stresses within Cu Bi-Crystal and Al Tri-Crystal after Plastic Deformation Observed by X-Ray and Neutron Diffraction

Microscopic residual stresses developed in a copper bi-crystal and in an aluminum tri-crystal after plastic deformation were investigated by X-ray and neutron diffraction. The copper bi-crystal tensile specimen was prepared so as to have a grain boundary along the tensile axis. The aluminum tri-crystal compressive specimen had a triple point and one of the grain boundaries was parallel to the compressive axis. The present study revealed that (1) residual micro-stresses are inhomogeneous within a crystal, (2) average residual stress in each crystal is different from each other, and (3) the direction of principal stress varies from grain to grain. Furthermore, the compatibility of residual stresses existing in both sides of a grain boundary was confirmed in a microscopic scale.