Barrel-Spinning-Assisted Nickel Plating onto Copper in Sulphate Solution to Enhance Corrosion Resistance

Nickel (Ni) is an interesting candidate for corrosion protection of copper (Cu) due to its present passive
area. Ni films with larger passive areas have better corrosion protection than those with smaller ones. In
the present research, Ni films were produced over Cu. A barreling apparatus was employed to support
the produced films in the sulphate solution. Various spinning speeds (0, 50, and 100 rpm) were used on
the barrel while it was being processed. Several investigations were conducted, such as deposition rate,
current efficiency, surface morphology, phase, film thickness, crystallographic orientation, and
electrochemical properties. Increased spinning speed resulted in a decrease in the deposition rate, current
efficiency, grain size, thickness, crystallite size, and exchange current density. Compared to a higher
spinning speed, the decrease in spinning speed caused an increase in the oxygen content, surface
roughness, and micro-strain. The higher speed of the barrel apparatus resulted in a lower corrosion rate
Ni film of 0.147 mmpy. Moreover, the lower speed of the barrel apparatus resulted in a higher exchange
current density Ni film of 0.997 A/cm².